LM234Z-AP
vs
LM334SMX
feature comparison
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
STMICROELECTRONICS
|
NATIONAL SEMICONDUCTOR CORP
|
| Part Package Code |
TO-92
|
|
| Package Description |
, SIP3,.1,50
|
PLASTIC, SOIC-8
|
| Pin Count |
3
|
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog IC - Other Type |
ANALOG CIRCUIT
|
ANALOG CIRCUIT
|
| JESD-30 Code |
O-PBCY-T3
|
R-PDSO-G8
|
| JESD-609 Code |
e3
|
e0
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
3
|
8
|
| Operating Temperature-Max |
100 °C
|
70 °C
|
| Operating Temperature-Min |
-25 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Equivalence Code |
SIP3,.1,50
|
SOP8,.25
|
| Package Shape |
ROUND
|
RECTANGULAR
|
| Package Style |
CYLINDRICAL
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
235
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
NO
|
YES
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Temperature Grade |
OTHER
|
COMMERCIAL
|
| Terminal Finish |
TIN
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
BOTTOM
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
30
|
| Base Number Matches |
1
|
2
|
| Rohs Code |
|
No
|
| ECCN Code |
|
EAR99
|
| Length |
|
4.9 mm
|
| Moisture Sensitivity Level |
|
1
|
| Package Code |
|
SOP
|
| Seated Height-Max |
|
1.75 mm
|
| Supply Voltage-Max (Vsup) |
|
40 V
|
| Supply Voltage-Min (Vsup) |
|
1 V
|
| Width |
|
3.9 mm
|
|
|
|
Compare LM234Z-AP with alternatives
Compare LM334SMX with alternatives