LM239AN vs LM239AN feature comparison

LM239AN NXP Semiconductors

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LM239AN onsemi

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS ONSEMI
Part Package Code MO-001 DIP
Package Description 0.300 INCH, PLASTIC, MO-001, SC-501-14, SOT27-1, DIP-14 PLASTIC, DIP-14
Pin Count 14 14
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Amplifier Type COMPARATOR COMPARATOR
Average Bias Current-Max (IIB) 0.4 µA 0.4 µA
Bias Current-Max (IIB) @25C 0.25 µA
Input Offset Voltage-Max 4000 µV 4000 µV
JESD-30 Code R-PDIP-T14 R-PDIP-T14
Length 19.025 mm 18.86 mm
Number of Functions 4 4
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -25 °C -25 °C
Output Type OPEN-COLLECTOR OPEN-COLLECTOR
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP14,.3 DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Response Time-Nom 1300 ns 1300 ns
Seated Height-Max 4.2 mm 4.69 mm
Supply Current-Max 2 mA 2 mA
Supply Voltage Limit-Max 36 V 36 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology BIPOLAR BIPOLAR
Temperature Grade OTHER OTHER
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 1 1
Pbfree Code No
JESD-609 Code e0
Peak Reflow Temperature (Cel) 235
Terminal Finish TIN LEAD
Time@Peak Reflow Temperature-Max (s) 30

Compare LM239AN with alternatives

Compare LM239AN with alternatives