LM2594HVN-3.3
vs
TC2574-3.3VPA
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
TELCOM SEMICONDUCTOR INC
|
| Package Description |
0.300 INCH, PLASTIC, DIP-8
|
PLASTIC, DIP-8
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Analog IC - Other Type |
SWITCHING REGULATOR
|
SWITCHING REGULATOR
|
| Control Mode |
VOLTAGE-MODE
|
CURRENT-MODE
|
| Control Technique |
PULSE WIDTH MODULATION
|
|
| Input Voltage-Max |
60 V
|
40 V
|
| Input Voltage-Min |
4.5 V
|
4.75 V
|
| Input Voltage-Nom |
12 V
|
12 V
|
| JESD-30 Code |
R-PDIP-T8
|
R-PDIP-T8
|
| JESD-609 Code |
e0
|
|
| Length |
9.817 mm
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Current-Max |
1.4 A
|
1.8 A
|
| Output Voltage-Nom |
3.3 V
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP8,.3
|
DIP8,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.08 mm
|
|
| Surface Mount |
NO
|
NO
|
| Switcher Configuration |
BUCK
|
BUCK
|
| Switching Frequency-Max |
173 kHz
|
63 kHz
|
| Technology |
BIPOLAR
|
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
7.62 mm
|
|
| Base Number Matches |
2
|
3
|
| Additional Feature |
|
Thermal Shutdown and Current Limit Protection
|
|
|
|
Compare LM2594HVN-3.3 with alternatives