LM2597HVM-12/NOPB
vs
ADP1109AAR
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
ANALOG DEVICES INC
|
| Package Description |
PLASTIC, SOIC-8
|
SOP, SOP8,.25
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog IC - Other Type |
SWITCHING REGULATOR
|
SWITCHING REGULATOR
|
| Control Mode |
CURRENT-MODE
|
VOLTAGE-MODE
|
| Control Technique |
PULSE WIDTH MODULATION
|
PULSE FREQUENCY MODULATION
|
| Input Voltage-Max |
60 V
|
9 V
|
| Input Voltage-Min |
4.5 V
|
2 V
|
| Input Voltage-Nom |
24 V
|
3 V
|
| JESD-30 Code |
R-PDSO-G8
|
R-PDSO-G8
|
| JESD-609 Code |
e3
|
e0
|
| Length |
4.9 mm
|
4.9 mm
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
125 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Output Current-Max |
1.4 A
|
1.2 A
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Equivalence Code |
SOP8,.25
|
SOP8,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.75 mm
|
1.75 mm
|
| Surface Mount |
YES
|
YES
|
| Switcher Configuration |
BUCK
|
BOOST
|
| Switching Frequency-Max |
173 kHz
|
155 kHz
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Temperature Grade |
AUTOMOTIVE
|
COMMERCIAL
|
| Terminal Finish |
Matte Tin (Sn)
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
3.9 mm
|
3.9 mm
|
| Base Number Matches |
2
|
2
|
| Part Package Code |
|
SOIC
|
| Pin Count |
|
8
|
|
|
|
Compare LM2597HVM-12/NOPB with alternatives
Compare ADP1109AAR with alternatives