LM2612ATL
vs
LM2612ATLX
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
TEXAS INSTRUMENTS INC
|
Package Description |
CSP-10
|
MICRO SMD-10
|
Reach Compliance Code |
not_compliant
|
unknown
|
Additional Feature |
PFM CONTROL TECHNIQUE IS ALSO POSSIBLE
|
ALSO VOUT=1.3, 1.5 AND 1.8 VOLT;PFM TECHNIQUE ALSO USED
|
Analog IC - Other Type |
SWITCHING REGULATOR
|
SWITCHING REGULATOR
|
Control Mode |
CURRENT-MODE
|
CURRENT-MODE
|
Control Technique |
PULSE WIDTH MODULATION
|
PULSE WIDTH MODULATION
|
Input Voltage-Max |
5.5 V
|
5.5 V
|
Input Voltage-Min |
2.8 V
|
2.8 V
|
Input Voltage-Nom |
3.6 V
|
3.6 V
|
JESD-30 Code |
R-PBGA-B10
|
R-PBGA-B10
|
JESD-609 Code |
e0
|
|
Length |
2.504 mm
|
2.504 mm
|
Moisture Sensitivity Level |
1
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
10
|
10
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-25 °C
|
-25 °C
|
Output Current-Max |
0.85 A
|
0.85 A
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VFBGA
|
VFBGA
|
Package Equivalence Code |
BGA10,3X4,20
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
0.675 mm
|
0.675 mm
|
Surface Mount |
YES
|
YES
|
Switcher Configuration |
BUCK
|
BUCK
|
Switching Frequency-Max |
732 kHz
|
1000 kHz
|
Technology |
CMOS
|
|
Temperature Grade |
OTHER
|
OTHER
|
Terminal Finish |
Tin/Lead (Sn63Pb37)
|
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
40
|
|
Width |
2.25 mm
|
2.25 mm
|
Base Number Matches |
3
|
2
|
Part Package Code |
|
BGA
|
Pin Count |
|
10
|
ECCN Code |
|
EAR99
|
HTS Code |
|
8542.39.00.01
|
Output Voltage-Nom |
|
1.05 V
|
|
|
|