LM2735XMYX
vs
LM2735YSDX/NOPB
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
NATIONAL SEMICONDUCTOR CORP
|
| Part Package Code |
MSOP
|
|
| Package Description |
HTSSOP,
|
LLP-6
|
| Pin Count |
8
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
ALSO OPERATES IN ADJUSTABLE MODE FROM 3V TO 24V
|
IT CAN ALSO OPERATE PEAK CURRENT
|
| Analog IC - Other Type |
SWITCHING REGULATOR
|
SWITCHING REGULATOR
|
| Control Mode |
CURRENT-MODE
|
VOLTAGE-MODE
|
| Control Technique |
PULSE WIDTH MODULATION
|
PULSE WIDTH MODULATION
|
| Input Voltage-Max |
5.5 V
|
5.5 V
|
| Input Voltage-Min |
2.7 V
|
2.7 V
|
| Input Voltage-Nom |
5 V
|
5 V
|
| JESD-30 Code |
S-PDSO-G8
|
S-XDSO-N6
|
| JESD-609 Code |
e0
|
e3
|
| Length |
3 mm
|
3 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
6
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
HTSSOP
|
HVSON
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Seated Height-Max |
1.09 mm
|
0.8 mm
|
| Surface Mount |
YES
|
YES
|
| Switcher Configuration |
BOOST
|
BOOST
|
| Switching Frequency-Max |
2000 kHz
|
680 kHz
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Finish |
TIN LEAD
|
Matte Tin (Sn)
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.65 mm
|
0.95 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
3 mm
|
3 mm
|
| Base Number Matches |
2
|
2
|
| Output Current-Max |
|
3 A
|
| Package Equivalence Code |
|
SOLCC6,.11,37
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Qualification Status |
|
Not Qualified
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
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