LM301AH
vs
LF355J8
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
HARRIS SEMICONDUCTOR
|
HARRIS SEMICONDUCTOR
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Architecture |
VOLTAGE-FEEDBACK
|
VOLTAGE-FEEDBACK
|
| Bias Current-Max (IIB) @25C |
0.25 µA
|
|
| Frequency Compensation |
NO
|
YES
|
| Input Offset Voltage-Max |
10000 µV
|
13000 µV
|
| JESD-30 Code |
O-MBCY-W8
|
R-XDIP-T8
|
| JESD-609 Code |
e0
|
e0
|
| Low-Offset |
NO
|
NO
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
METAL
|
CERAMIC
|
| Package Equivalence Code |
CAN8,.2
|
DIP8,.3
|
| Package Shape |
ROUND
|
RECTANGULAR
|
| Package Style |
CYLINDRICAL
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Technology |
BIPOLAR
|
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
WIRE
|
THROUGH-HOLE
|
| Terminal Position |
BOTTOM
|
DUAL
|
| Base Number Matches |
1
|
1
|
| Package Description |
|
DIP, DIP8,.3
|
| Low-Bias |
|
YES
|
| Package Code |
|
DIP
|
| Surface Mount |
|
NO
|
| Terminal Pitch |
|
2.54 mm
|
|
|
|
Compare LM301AH with alternatives
Compare LF355J8 with alternatives