LM301AN vs LM358MENG feature comparison

LM301AN National Semiconductor Corporation

Buy Now Datasheet

LM358MENG National Semiconductor Corporation

Buy Now Datasheet
Rohs Code No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP NATIONAL SEMICONDUCTOR CORP
Part Package Code DIP SOIC
Package Description PLASTIC, DIP-8 SOP,
Pin Count 8 8
Reach Compliance Code not_compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.33.00.01 8542.33.00.01
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Architecture VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB) 0.3 µA 0.5 µA
Bias Current-Max (IIB) @25C 0.25 µA
Common-mode Reject Ratio-Nom 90 dB 85 dB
Frequency Compensation NO
Input Offset Voltage-Max 10000 µV 9000 µV
JESD-30 Code R-PDIP-T8 R-PDSO-G8
JESD-609 Code e0
Length 9.817 mm 4.9 mm
Low-Offset NO
Moisture Sensitivity Level 1
Neg Supply Voltage Limit-Max -18 V
Neg Supply Voltage-Nom (Vsup) -15 V
Number of Functions 1 2
Number of Terminals 8 8
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP8,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Packing Method RAIL
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 1.75 mm
Slew Rate-Nom 0.5 V/us 0.1 V/us
Supply Current-Max 3 mA
Supply Voltage Limit-Max 18 V 32 V
Supply Voltage-Nom (Vsup) 15 V 5 V
Surface Mount NO YES
Technology BIPOLAR BIPOLAR
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 40
Unity Gain BW-Nom 1000 1000
Voltage Gain-Min 15000
Width 7.62 mm 3.9 mm
Base Number Matches 5 1

Compare LM301AN with alternatives

Compare LM358MENG with alternatives