LM308AN
vs
LM108N-14
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA INC
|
SIGNETICS CORP
|
| Package Description |
PLASTIC, DIP-8
|
DIP,
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Architecture |
VOLTAGE-FEEDBACK
|
|
| Average Bias Current-Max (IIB) |
0.01 µA
|
|
| Bias Current-Max (IIB) @25C |
0.007 µA
|
|
| Common-mode Reject Ratio-Min |
96 dB
|
|
| Common-mode Reject Ratio-Nom |
110 dB
|
|
| Frequency Compensation |
NO
|
|
| Input Offset Voltage-Max |
730 µV
|
|
| JESD-30 Code |
R-PDIP-T8
|
R-PDIP-T8
|
| JESD-609 Code |
e0
|
|
| Length |
9.78 mm
|
9.4 mm
|
| Low-Bias |
NO
|
|
| Low-Offset |
YES
|
|
| Micropower |
YES
|
|
| Neg Supply Voltage Limit-Max |
-18 V
|
|
| Neg Supply Voltage-Nom (Vsup) |
-15 V
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
70 °C
|
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP8,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Power |
NO
|
|
| Programmable Power |
NO
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.45 mm
|
3.93 mm
|
| Supply Current-Max |
0.8 mA
|
|
| Supply Voltage Limit-Max |
18 V
|
|
| Supply Voltage-Nom (Vsup) |
15 V
|
|
| Surface Mount |
NO
|
NO
|
| Technology |
BIPOLAR
|
|
| Temperature Grade |
COMMERCIAL
|
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Unity Gain BW-Nom |
1000
|
|
| Voltage Gain-Min |
60000
|
|
| Wideband |
NO
|
|
| Width |
7.62 mm
|
7.62 mm
|
| Base Number Matches |
13
|
3
|
| Part Package Code |
|
DIP
|
| Pin Count |
|
8
|
|
|
|
Compare LM108N-14 with alternatives