LM308V vs M38510/10104BPA feature comparison

LM308V Philips Semiconductors

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M38510/10104BPA Freescale Semiconductor

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SIGNETICS CORP MOTOROLA SEMICONDUCTOR PRODUCTS
Package Description , DIP, DIP8,.3
Reach Compliance Code unknown unknown
ECCN Code EAR99
HTS Code 8542.33.00.01
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Average Bias Current-Max (IIB) 0.007 µA
JESD-30 Code R-PDIP-T8 R-XDIP-T8
Neg Supply Voltage-Nom (Vsup) -15 V
Number of Functions 1 1
Number of Terminals 8 8
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Package Body Material PLASTIC/EPOXY CERAMIC
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Supply Voltage-Nom (Vsup) 15 V
Surface Mount NO NO
Technology BIPOLAR BIPOLAR
Temperature Grade COMMERCIAL MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 3 11
Rohs Code No
Architecture VOLTAGE-FEEDBACK
Bias Current-Max (IIB) @25C 0.002 µA
Frequency Compensation NO
Input Offset Voltage-Max 1000 µV
JESD-609 Code e0
Low-Offset NO
Package Code DIP
Package Equivalence Code DIP8,.3
Power Supplies +-5/+-20 V
Screening Level 38535Q/M;38534H;883B
Slew Rate-Min 0.05 V/us
Supply Voltage Limit-Max 22 V
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Pitch 2.54 mm
Voltage Gain-Min 20000

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