LM317HVG vs LM317KMDC feature comparison

LM317HVG TT Electronics Power and Hybrid / Semelab Limited

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LM317KMDC National Semiconductor Corporation

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SEMELAB LTD NATIONAL SEMICONDUCTOR CORP
Part Package Code TO-257
Package Description TO-257, DIE, DIE OR CHIP
Pin Count 3
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-MSFM-P3 X-XUUC-N
Number of Functions 1 1
Number of Terminals 3
Output Current1-Max 1.5 A 1.5 A
Package Body Material METAL UNSPECIFIED
Package Code TO-257 DIE
Package Shape RECTANGULAR UNSPECIFIED
Package Style FLANGE MOUNT UNCASED CHIP
Qualification Status Not Qualified Not Qualified
Regulator Type ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR
Surface Mount NO YES
Terminal Form PIN/PEG NO LEAD
Terminal Position SINGLE UPPER
Base Number Matches 1 2
Rohs Code Yes
Adjustability ADJUSTABLE
Dropout Voltage1-Nom 3 V
Line Regulation-Max (%/V) 0.07
Load Regulation-Max(%) 1.5%
Moisture Sensitivity Level 1
Number of Outputs 1
Operating Temperature TJ-Max 125 °C
Operating Temperature TJ-Min
Output Voltage1-Max 37 V
Output Voltage1-Min 1.2 V
Package Equivalence Code DIE OR CHIP
Peak Reflow Temperature (Cel) 260
Technology BIPOLAR
Time@Peak Reflow Temperature-Max (s) 40

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