LM317LIBP
vs
LM317LITP
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
NATIONAL SEMICONDUCTOR CORP
|
Package Description |
MO-211BC, MICRO, SMD-6
|
FBGA, BGA6,2X3,20
|
Reach Compliance Code |
not_compliant
|
compliant
|
Adjustability |
ADJUSTABLE
|
ADJUSTABLE
|
Dropout Voltage1-Nom |
3 V
|
3 V
|
Input-Output Voltage Differential-Max |
40 V
|
40 V
|
Input-Output Voltage Differential-Min |
3 V
|
3 V
|
JESD-30 Code |
R-PBGA-B6
|
R-PBGA-B6
|
JESD-609 Code |
e0
|
e1
|
Length |
1.615 mm
|
1.615 mm
|
Line Regulation-Max (%/V) |
0.07
|
0.07
|
Load Regulation-Max(%) |
1.5%
|
1.5%
|
Moisture Sensitivity Level |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Outputs |
1
|
1
|
Number of Terminals |
6
|
6
|
Operating Temperature TJ-Max |
125 °C
|
125 °C
|
Operating Temperature TJ-Min |
-40 °C
|
-40 °C
|
Output Current1-Max |
0.1 A
|
0.1 A
|
Output Voltage1-Max |
37 V
|
37 V
|
Output Voltage1-Min |
1.2 V
|
1.2 V
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
FBGA
|
FBGA
|
Package Equivalence Code |
BGA6,2X3,20
|
BGA6,2X3,20
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, FINE PITCH
|
GRID ARRAY, FINE PITCH
|
Packing Method |
TR
|
TR
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Regulator Type |
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR
|
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR
|
Surface Mount |
YES
|
YES
|
Technology |
BIPOLAR
|
BIPOLAR
|
Terminal Finish |
Tin/Lead (Sn63Pb37)
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
Width |
0.955 mm
|
0.955 mm
|
Base Number Matches |
1
|
4
|
ECCN Code |
|
EAR99
|
HTS Code |
|
8542.39.00.01
|
|
|
|
Compare LM317LIBP with alternatives
Compare LM317LITP with alternatives