LM317LIBP
vs
LM317LITPX/NOPB
feature comparison
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
NATIONAL SEMICONDUCTOR CORP
|
| Package Description |
,
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| Base Number Matches |
4
|
2
|
| Rohs Code |
|
Yes
|
| Adjustability |
|
ADJUSTABLE
|
| Dropout Voltage1-Nom |
|
3 V
|
| JESD-30 Code |
|
R-PBGA-B6
|
| JESD-609 Code |
|
e1
|
| Line Regulation-Max (%/V) |
|
0.07
|
| Load Regulation-Max(%) |
|
1.5%
|
| Moisture Sensitivity Level |
|
1
|
| Number of Outputs |
|
1
|
| Number of Terminals |
|
6
|
| Operating Temperature TJ-Max |
|
125 °C
|
| Operating Temperature TJ-Min |
|
-40 °C
|
| Output Current1-Max |
|
0.1 A
|
| Output Voltage1-Max |
|
37 V
|
| Output Voltage1-Min |
|
1.2 V
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
FBGA
|
| Package Equivalence Code |
|
BGA6,2X3,20
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
GRID ARRAY, FINE PITCH
|
| Packing Method |
|
TR
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Qualification Status |
|
Not Qualified
|
| Surface Mount |
|
YES
|
| Technology |
|
BIPOLAR
|
| Terminal Finish |
|
TIN SILVER COPPER
|
| Terminal Form |
|
BALL
|
| Terminal Pitch |
|
0.5 mm
|
| Terminal Position |
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|