LM317MT
vs
LM117HMW8
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA SEMICONDUCTOR PRODUCTS
|
NATIONAL SEMICONDUCTOR CORP
|
| Package Description |
, SIP3,.1TB
|
DIE, WAFER
|
| Reach Compliance Code |
unknown
|
compliant
|
| Adjustability |
ADJUSTABLE
|
ADJUSTABLE
|
| Dropout Voltage1-Nom |
3 V
|
3 V
|
| JESD-609 Code |
e0
|
|
| Line Regulation-Max (%/V) |
0.07
|
0.05
|
| Load Regulation-Max(%) |
1.5%
|
1%
|
| Number of Outputs |
1
|
1
|
| Number of Terminals |
3
|
|
| Operating Temperature TJ-Max |
125 °C
|
150 °C
|
| Operating Temperature TJ-Min |
|
-55 °C
|
| Output Current1-Max |
0.5 A
|
1.5 A
|
| Output Voltage1-Max |
37 V
|
37 V
|
| Output Voltage1-Min |
1.2 V
|
1.2 V
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Equivalence Code |
SIP3,.1TB
|
WAFER
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
NO
|
YES
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
SINGLE
|
UPPER
|
| Base Number Matches |
6
|
2
|
| Pbfree Code |
|
Yes
|
| Part Package Code |
|
WAFER
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.39.00.01
|
| JESD-30 Code |
|
X-XUUC-N
|
| Moisture Sensitivity Level |
|
1
|
| Number of Functions |
|
1
|
| Package Code |
|
DIE
|
| Package Shape |
|
UNSPECIFIED
|
| Package Style |
|
UNCASED CHIP
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Regulator Type |
|
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR
|
| Screening Level |
|
38535Q/M;38534H;883B
|
| Terminal Form |
|
NO LEAD
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare LM117HMW8 with alternatives