LM324ADR2
vs
KA324AD
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
MOTOROLA SEMICONDUCTOR PRODUCTS
|
SAMSUNG SEMICONDUCTOR INC
|
| Package Description |
SOP, SOP14,.25
|
SOP-14
|
| Reach Compliance Code |
unknown
|
compliant
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Architecture |
VOLTAGE-FEEDBACK
|
VOLTAGE-FEEDBACK
|
| Frequency Compensation |
YES
|
YES
|
| Input Offset Voltage-Max |
5000 µV
|
5000 µV
|
| JESD-30 Code |
R-PDSO-G14
|
R-PDSO-G14
|
| JESD-609 Code |
e0
|
e0
|
| Low-Offset |
NO
|
NO
|
| Micropower |
YES
|
YES
|
| Number of Functions |
4
|
4
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Equivalence Code |
SOP14,.25
|
SOP14,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Packing Method |
TAPE AND REEL
|
|
| Power Supplies |
5/30 V
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
YES
|
YES
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
4
|
2
|
| Part Package Code |
|
SOIC
|
| Pin Count |
|
14
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.33.00.01
|
| Average Bias Current-Max (IIB) |
|
0.2 µA
|
| Bias Current-Max (IIB) @25C |
|
0.1 µA
|
| Common-mode Reject Ratio-Nom |
|
85 dB
|
| Neg Supply Voltage Limit-Max |
|
-18 V
|
| Supply Current-Max |
|
3 mA
|
| Supply Voltage Limit-Max |
|
18 V
|
| Supply Voltage-Nom (Vsup) |
|
5 V
|
| Voltage Gain-Min |
|
15000
|
|
|
|
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