LM324D
vs
LM324KDR
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ADVANCED MICRO DEVICES INC
|
ROHM CO LTD
|
| Part Package Code |
DIP
|
SOIC
|
| Package Description |
HERMETIC SEALED, DIP-14
|
LSOP, SOP8,.25
|
| Pin Count |
14
|
14
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Architecture |
VOLTAGE-FEEDBACK
|
VOLTAGE-FEEDBACK
|
| Average Bias Current-Max (IIB) |
0.5 µA
|
0.5 µA
|
| Bias Current-Max (IIB) @25C |
0.25 µA
|
0.25 µA
|
| Common-mode Reject Ratio-Nom |
70 dB
|
65 dB
|
| Frequency Compensation |
YES
|
YES
|
| Input Offset Voltage-Max |
9000 µV
|
9000 µV
|
| JESD-30 Code |
R-CDIP-T14
|
R-PDSO-G14
|
| JESD-609 Code |
e0
|
e2
|
| Length |
19.431 mm
|
8.65 mm
|
| Low-Offset |
NO
|
NO
|
| Micropower |
YES
|
YES
|
| Number of Functions |
4
|
4
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
LSOP
|
| Package Equivalence Code |
DIP14,.3
|
SOP8,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE, LOW PROFILE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.08 mm
|
1.65 mm
|
| Supply Current-Max |
3 mA
|
3 mA
|
| Supply Voltage Limit-Max |
16 V
|
32 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Copper (Sn/Cu)
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Unity Gain BW-Nom |
1000
|
1200
|
| Voltage Gain-Min |
15000
|
25000
|
| Width |
7.62 mm
|
3.9 mm
|
| Base Number Matches |
11
|
2
|
| Pbfree Code |
|
Yes
|
| Samacsys Manufacturer |
|
ROHM Semiconductor
|
| Packing Method |
|
TAPE AND REEL
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Slew Rate-Nom |
|
0.5 V/us
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare LM324D with alternatives