LM324DR2G
vs
LM324D
feature comparison
| Rohs Code |
|
Yes
|
| Part Life Cycle Code |
|
Active
|
| Ihs Manufacturer |
|
STMICROELECTRONICS
|
| Part Package Code |
|
SOIC
|
| Package Description |
|
ROHS COMPLIANT, MICRO, PLASTIC, SOP-14
|
| Pin Count |
|
14
|
| Reach Compliance Code |
|
compliant
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.33.00.01
|
| Factory Lead Time |
|
10 Weeks
|
| Samacsys Manufacturer |
|
STMicroelectronics
|
| Amplifier Type |
|
OPERATIONAL AMPLIFIER
|
| Architecture |
|
VOLTAGE-FEEDBACK
|
| Average Bias Current-Max (IIB) |
|
0.3 µA
|
| Bias Current-Max (IIB) @25C |
|
0.15 µA
|
| Common-mode Reject Ratio-Nom |
|
80 dB
|
| Frequency Compensation |
|
YES
|
| Input Offset Voltage-Max |
|
9000 µV
|
| JESD-30 Code |
|
R-PDSO-G14
|
| JESD-609 Code |
|
e4
|
| Length |
|
8.65 mm
|
| Low-Offset |
|
NO
|
| Micropower |
|
YES
|
| Moisture Sensitivity Level |
|
1
|
| Number of Functions |
|
4
|
| Number of Terminals |
|
14
|
| Operating Temperature-Max |
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
SOP
|
| Package Equivalence Code |
|
SOP14,.25
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
SMALL OUTLINE
|
| Packing Method |
|
TUBE
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
1.75 mm
|
| Slew Rate-Nom |
|
0.4 V/us
|
| Supply Current-Max |
|
3 mA
|
| Supply Voltage Limit-Max |
|
32 V
|
| Supply Voltage-Nom (Vsup) |
|
5 V
|
| Surface Mount |
|
YES
|
| Technology |
|
BIPOLAR
|
| Temperature Grade |
|
COMMERCIAL
|
| Terminal Finish |
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
| Terminal Form |
|
GULL WING
|
| Terminal Pitch |
|
1.27 mm
|
| Terminal Position |
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
| Unity Gain BW-Nom |
|
1300
|
| Voltage Gain-Min |
|
25000
|
| Width |
|
3.9 mm
|
| Base Number Matches |
|
3
|
|
|
|
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