LM324DT vs LM324D feature comparison

LM324DT STMicroelectronics

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LM324D AMD

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Rohs Code Yes No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer STMICROELECTRONICS ADVANCED MICRO DEVICES INC
Part Package Code SOIC DIP
Package Description SOP-14 HERMETIC SEALED, DIP-14
Pin Count 14 14
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.33.00.01 8542.33.00.01
Factory Lead Time 8 Weeks
Samacsys Manufacturer STMicroelectronics
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Architecture VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB) 0.3 µA 0.5 µA
Bias Current-Max (IIB) @25C 0.15 µA 0.25 µA
Common-mode Reject Ratio-Nom 80 dB 70 dB
Frequency Compensation YES YES
Input Offset Voltage-Max 9000 µV 9000 µV
JESD-30 Code R-PDSO-G14 R-CDIP-T14
JESD-609 Code e3 e0
Length 8.65 mm 19.431 mm
Low-Offset NO NO
Micropower YES YES
Moisture Sensitivity Level 1
Number of Functions 4 4
Number of Terminals 14 14
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code SOP DIP
Package Equivalence Code SOP14,.25 DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Packing Method TAPE AND REEL
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 5.08 mm
Slew Rate-Nom 0.4 V/us
Supply Current-Max 3 mA 3 mA
Supply Voltage Limit-Max 32 V 16 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology BIPOLAR BIPOLAR
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Matte Tin (Sn) - annealed Tin/Lead (Sn/Pb)
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Unity Gain BW-Nom 1300 1000
Voltage Gain-Min 25000 15000
Width 3.9 mm 7.62 mm
Base Number Matches 1 1

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