LM324DTBR2G
vs
LM324MT/NOPB
feature comparison
| Pbfree Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ONSEMI
|
ROCHESTER ELECTRONICS LLC
|
| Part Package Code |
TSSOP-14
|
|
| Package Description |
TSSOP-14
|
|
| Pin Count |
14
|
|
| Manufacturer Package Code |
948G
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Factory Lead Time |
32 Weeks
|
|
| Samacsys Manufacturer |
onsemi
|
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
|
| Architecture |
VOLTAGE-FEEDBACK
|
|
| Average Bias Current-Max (IIB) |
0.5 µA
|
|
| Bias Current-Max (IIB) @25C |
0.25 µA
|
|
| Common-mode Reject Ratio-Nom |
70 dB
|
|
| Frequency Compensation |
YES
|
|
| Input Offset Voltage-Max |
7000 µV
|
|
| JESD-30 Code |
R-PDSO-G14
|
|
| JESD-609 Code |
e4
|
|
| Length |
5 mm
|
|
| Low-Offset |
NO
|
|
| Micropower |
YES
|
|
| Moisture Sensitivity Level |
1
|
1
|
| Neg Supply Voltage Limit-Max |
-16 V
|
|
| Number of Functions |
4
|
|
| Number of Terminals |
14
|
|
| Operating Temperature-Max |
70 °C
|
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
TSSOP
|
|
| Package Equivalence Code |
TSSOP14,.25
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
|
| Packing Method |
TAPE AND REEL
|
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.2 mm
|
|
| Supply Current-Max |
3 mA
|
|
| Supply Voltage Limit-Max |
16 V
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
|
| Surface Mount |
YES
|
|
| Technology |
BIPOLAR
|
|
| Temperature Grade |
COMMERCIAL
|
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
TIN
|
| Terminal Form |
GULL WING
|
|
| Terminal Pitch |
0.65 mm
|
|
| Terminal Position |
DUAL
|
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Voltage Gain-Min |
15000
|
|
| Width |
4.4 mm
|
|
| Base Number Matches |
1
|
3
|
| Rohs Code |
|
Yes
|
|
|
|
Compare LM324DTBR2G with alternatives