LM324J/NOPB
vs
LPV324MX
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
NATIONAL SEMICONDUCTOR CORP
|
| Part Package Code |
DIP
|
SOIC
|
| Package Description |
DIP,
|
SOIC-14
|
| Pin Count |
14
|
14
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Average Bias Current-Max (IIB) |
0.5 µA
|
0.06 µA
|
| Common-mode Reject Ratio-Min |
65 dB
|
|
| Common-mode Reject Ratio-Nom |
85 dB
|
71 dB
|
| Input Offset Voltage-Max |
9000 µV
|
10000 µV
|
| JESD-30 Code |
R-GDIP-T14
|
R-PDSO-G14
|
| Length |
19.43 mm
|
8.6235 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Neg Supply Voltage Limit-Max |
|
|
| Neg Supply Voltage-Nom (Vsup) |
|
|
| Number of Functions |
4
|
4
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
SOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.08 mm
|
1.753 mm
|
| Slew Rate-Nom |
0.5 V/us
|
0.1 V/us
|
| Supply Voltage Limit-Max |
32 V
|
5.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
BIPOLAR
|
BICMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Unity Gain BW-Nom |
1000
|
152
|
| Voltage Gain-Min |
25000
|
10000
|
| Width |
7.62 mm
|
3.899 mm
|
| Base Number Matches |
1
|
2
|
| Architecture |
|
VOLTAGE-FEEDBACK
|
| Bias Current-Max (IIB) @25C |
|
0.05 µA
|
| Frequency Compensation |
|
YES
|
| JESD-609 Code |
|
e0
|
| Low-Bias |
|
NO
|
| Low-Offset |
|
NO
|
| Micropower |
|
YES
|
| Package Equivalence Code |
|
SOP14,.25
|
| Packing Method |
|
TAPE AND REEL
|
| Peak Reflow Temperature (Cel) |
|
235
|
| Power |
|
NO
|
| Programmable Power |
|
NO
|
| Supply Current-Max |
|
0.046 mA
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
| Wideband |
|
NO
|
|
|
|
Compare LM324J/NOPB with alternatives
Compare LPV324MX with alternatives