LM324MX/NOPB
vs
LM324D
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
SAMSUNG SEMICONDUCTOR INC
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Moisture Sensitivity Level |
1
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Terminal Finish |
TIN
|
TIN LEAD
|
| Base Number Matches |
3
|
10
|
| Part Package Code |
|
SOIC
|
| Package Description |
|
SOP-14
|
| Pin Count |
|
14
|
| Amplifier Type |
|
OPERATIONAL AMPLIFIER
|
| Architecture |
|
VOLTAGE-FEEDBACK
|
| Average Bias Current-Max (IIB) |
|
0.5 µA
|
| Bias Current-Max (IIB) @25C |
|
0.25 µA
|
| Common-mode Reject Ratio-Nom |
|
100 dB
|
| Frequency Compensation |
|
YES
|
| Input Offset Voltage-Max |
|
9000 µV
|
| JESD-30 Code |
|
R-PDSO-G14
|
| JESD-609 Code |
|
e0
|
| Length |
|
9.98 mm
|
| Low-Offset |
|
NO
|
| Micropower |
|
YES
|
| Neg Supply Voltage Limit-Max |
|
-18 V
|
| Number of Functions |
|
4
|
| Number of Terminals |
|
14
|
| Operating Temperature-Max |
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
SOP
|
| Package Equivalence Code |
|
SOP14,.25
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
SMALL OUTLINE
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
1.73 mm
|
| Supply Current-Max |
|
3 mA
|
| Supply Voltage Limit-Max |
|
18 V
|
| Supply Voltage-Nom (Vsup) |
|
5 V
|
| Surface Mount |
|
YES
|
| Technology |
|
BIPOLAR
|
| Temperature Grade |
|
COMMERCIAL
|
| Terminal Form |
|
GULL WING
|
| Terminal Pitch |
|
1.27 mm
|
| Terminal Position |
|
DUAL
|
| Voltage Gain-Min |
|
15000
|
| Width |
|
4.495 mm
|
|
|
|
Compare LM324D with alternatives