LM339AN
vs
LM193FE883B
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
SAMSUNG SEMICONDUCTOR INC
|
NXP SEMICONDUCTORS
|
Package Description |
DIP-14
|
DIP,
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Amplifier Type |
COMPARATOR
|
COMPARATOR
|
Bias Current-Max (IIB) @25C |
0.25 µA
|
|
Input Offset Voltage-Max |
4000 µV
|
10000 µV
|
JESD-30 Code |
R-PDIP-T14
|
R-GDIP-T8
|
JESD-609 Code |
e0
|
|
Number of Functions |
4
|
2
|
Number of Terminals |
14
|
8
|
Operating Temperature-Max |
70 °C
|
125 °C
|
Operating Temperature-Min |
|
-55 °C
|
Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
Package Code |
DIP
|
DIP
|
Package Equivalence Code |
DIP14,.3
|
DIP8,.3
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Response Time-Nom |
1400 ns
|
1300 ns
|
Supply Current-Max |
2 mA
|
|
Supply Voltage Limit-Max |
36 V
|
36 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
NO
|
NO
|
Technology |
BIPOLAR
|
BIPOLAR
|
Temperature Grade |
COMMERCIAL
|
MILITARY
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
20
|
1
|
Part Package Code |
|
DIP
|
Pin Count |
|
8
|
Average Bias Current-Max (IIB) |
|
0.3 µA
|
Length |
|
9.955 mm
|
Neg Supply Voltage Limit-Max |
|
|
Neg Supply Voltage-Nom (Vsup) |
|
|
Output Type |
|
OPEN-COLLECTOR
|
Screening Level |
|
MIL-STD-883 Class B
|
Seated Height-Max |
|
5.08 mm
|
Width |
|
7.62 mm
|
|
|
|
Compare LM339AN with alternatives
Compare LM193FE883B with alternatives