LM3530UMX-40/NOPB
vs
LM3530UME-40NOPB
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
NATIONAL SEMICONDUCTOR CORP
|
| Package Description |
DSBGA-12
|
1.215 X 1.615 MM, 0.425 MM HEIGHT, USMD-12
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Samacsys Manufacturer |
Texas Instruments
|
|
| Data Input Mode |
SERIAL
|
|
| Input Characteristics |
STANDARD
|
|
| Interface IC Type |
LED DISPLAY DRIVER
|
LED DISPLAY DRIVER
|
| JESD-30 Code |
R-PBGA-B12
|
R-PBGA-B12
|
| JESD-609 Code |
e1
|
|
| Length |
1.61 mm
|
|
| Moisture Sensitivity Level |
1
|
|
| Multiplexed Display Capability |
NO
|
|
| Number of Channels |
1
|
|
| Number of Functions |
1
|
|
| Number of Segments |
10
|
|
| Number of Terminals |
12
|
12
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-30 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VFBGA
|
|
| Package Equivalence Code |
BGA12,3X4,16
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
0.675 mm
|
|
| Supply Voltage-Max |
5.5 V
|
|
| Supply Voltage-Min |
2.7 V
|
|
| Supply Voltage-Nom |
3.6 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
|
| Temperature Grade |
OTHER
|
|
| Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.4 mm
|
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
1.21 mm
|
|
| fmax-Min |
0.5 MHz
|
|
| Base Number Matches |
1
|
2
|
| Part Package Code |
|
BGA
|
| Pin Count |
|
12
|
|
|
|
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