LM358BPX vs LM358TPX/NOPB feature comparison

LM358BPX National Semiconductor Corporation

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LM358TPX/NOPB National Semiconductor Corporation

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Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP NATIONAL SEMICONDUCTOR CORP
Package Description MICRO, BUMP, SMD-8 FBGA, BGA8,3X3,20
Reach Compliance Code not_compliant compliant
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Architecture VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB) 0.05 µA 0.05 µA
Bias Current-Max (IIB) @25C 0.25 µA 0.25 µA
Common-mode Reject Ratio-Nom 85 dB 85 dB
Frequency Compensation YES YES
Input Offset Voltage-Max 9000 µV 9000 µV
JESD-30 Code S-PBGA-B8 S-PBGA-B8
JESD-609 Code e0 e1
Length 1.285 mm 1.285 mm
Low-Offset NO NO
Moisture Sensitivity Level 1 1
Neg Supply Voltage Limit-Max
Neg Supply Voltage-Nom (Vsup)
Number of Functions 2 2
Number of Terminals 8 8
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code FBGA FBGA
Package Equivalence Code BGA8,3X3,20 BGA8,3X3,20
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH
Packing Method TAPE AND REEL TAPE AND REEL
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
Slew Rate-Nom 0.1 V/us
Supply Current-Max 2 mA 2 mA
Supply Voltage Limit-Max 32 V 32 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology BIPOLAR BIPOLAR
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn63Pb37) Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40 40
Unity Gain BW-Nom 1000 1000
Voltage Gain-Min 15000 15000
Width 1.285 mm 1.285 mm
Base Number Matches 2 2
Part Package Code BGA
Pin Count 8
ECCN Code EAR99
HTS Code 8542.33.00.01

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