LM358DP
vs
CA0358T
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
PHILIPS SEMICONDUCTORS
|
INTERSIL CORP
|
Package Description |
TSSOP, TSSOP8,.19
|
, CAN8,.2
|
Reach Compliance Code |
unknown
|
not_compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.33.00.01
|
8542.33.00.01
|
Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
Architecture |
VOLTAGE-FEEDBACK
|
VOLTAGE-FEEDBACK
|
Average Bias Current-Max (IIB) |
0.5 µA
|
|
Bias Current-Max (IIB) @25C |
0.25 µA
|
|
Common-mode Reject Ratio-Min |
65 dB
|
|
Common-mode Reject Ratio-Nom |
70 dB
|
|
Frequency Compensation |
YES
|
YES
|
Input Offset Voltage-Max |
9000 µV
|
9000 µV
|
JESD-30 Code |
S-PDSO-G8
|
O-MBCY-W8
|
JESD-609 Code |
e0
|
e0
|
Length |
3 mm
|
|
Low-Bias |
NO
|
|
Low-Offset |
NO
|
NO
|
Micropower |
YES
|
|
Number of Functions |
2
|
2
|
Number of Terminals |
8
|
8
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Package Body Material |
PLASTIC/EPOXY
|
METAL
|
Package Code |
TSSOP
|
|
Package Equivalence Code |
TSSOP8,.1
|
CAN8,.2
|
Package Shape |
SQUARE
|
ROUND
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
CYLINDRICAL
|
Packing Method |
TAPE AND REEL
|
|
Power |
NO
|
|
Programmable Power |
NO
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.1 mm
|
|
Slew Rate-Nom |
0.3 V/us
|
|
Supply Current-Max |
1.2 mA
|
|
Supply Voltage Limit-Max |
32 V
|
|
Supply Voltage-Nom (Vsup) |
5 V
|
|
Surface Mount |
YES
|
|
Technology |
BIPOLAR
|
BIPOLAR
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
GULL WING
|
WIRE
|
Terminal Pitch |
0.65 mm
|
|
Terminal Position |
DUAL
|
BOTTOM
|
Unity Gain BW-Nom |
1000
|
|
Voltage Gain-Min |
15000
|
|
Wideband |
NO
|
|
Width |
3 mm
|
|
Base Number Matches |
2
|
2
|
Part Package Code |
|
BCY
|
Pin Count |
|
8
|
|
|
|