LM358DP vs LM358J feature comparison

LM358DP Philips Semiconductors

Buy Now Datasheet

LM358J National Semiconductor Corporation

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer PHILIPS SEMICONDUCTORS NATIONAL SEMICONDUCTOR CORP
Package Description TSSOP, TSSOP8,.19 DIP, DIP8,.3
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.33.00.01 8542.33.00.01
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Architecture VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB) 0.5 µA 0.25 µA
Bias Current-Max (IIB) @25C 0.25 µA 0.25 µA
Common-mode Reject Ratio-Min 65 dB 65 dB
Common-mode Reject Ratio-Nom 70 dB 85 dB
Frequency Compensation YES YES
Input Offset Voltage-Max 9000 µV 7000 µV
JESD-30 Code S-PDSO-G8 R-GDIP-T8
JESD-609 Code e0 e0
Length 3 mm
Low-Bias NO
Low-Offset NO NO
Micropower YES
Number of Functions 2 2
Number of Terminals 8 8
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code TSSOP DIP
Package Equivalence Code TSSOP8,.1 DIP8,.3
Package Shape SQUARE RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH IN-LINE
Packing Method TAPE AND REEL
Power NO
Programmable Power NO
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 5.08 mm
Slew Rate-Nom 0.3 V/us
Supply Current-Max 1.2 mA 2 mA
Supply Voltage Limit-Max 32 V 32 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology BIPOLAR BIPOLAR
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.65 mm 2.54 mm
Terminal Position DUAL DUAL
Unity Gain BW-Nom 1000 1000
Voltage Gain-Min 15000 25000
Wideband NO
Width 3 mm 7.62 mm
Base Number Matches 2 7
Part Package Code DIP
Pin Count 8

Compare LM358J with alternatives