LM358DR2G
vs
LM358M/NOPB
feature comparison
| Rohs Code |
|
Yes
|
| Part Life Cycle Code |
|
Transferred
|
| Ihs Manufacturer |
|
NATIONAL SEMICONDUCTOR CORP
|
| Part Package Code |
|
SOIC
|
| Package Description |
|
SOIC-8
|
| Pin Count |
|
8
|
| Reach Compliance Code |
|
compliant
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.33.00.01
|
| Amplifier Type |
|
OPERATIONAL AMPLIFIER
|
| Architecture |
|
VOLTAGE-FEEDBACK
|
| Average Bias Current-Max (IIB) |
|
0.05 µA
|
| Bias Current-Max (IIB) @25C |
|
0.25 µA
|
| Common-mode Reject Ratio-Min |
|
65 dB
|
| Common-mode Reject Ratio-Nom |
|
85 dB
|
| Frequency Compensation |
|
YES
|
| Input Offset Voltage-Max |
|
9000 µV
|
| JESD-30 Code |
|
R-PDSO-G8
|
| JESD-609 Code |
|
e3
|
| Length |
|
4.9 mm
|
| Low-Offset |
|
NO
|
| Moisture Sensitivity Level |
|
1
|
| Neg Supply Voltage Limit-Max |
|
|
| Neg Supply Voltage-Nom (Vsup) |
|
|
| Number of Functions |
|
2
|
| Number of Terminals |
|
8
|
| Operating Temperature-Max |
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
SOP
|
| Package Equivalence Code |
|
SOP8,.25
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
SMALL OUTLINE
|
| Packing Method |
|
RAIL
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
1.75 mm
|
| Slew Rate-Nom |
|
0.1 V/us
|
| Supply Current-Max |
|
2 mA
|
| Supply Voltage Limit-Max |
|
32 V
|
| Supply Voltage-Nom (Vsup) |
|
5 V
|
| Surface Mount |
|
YES
|
| Technology |
|
BIPOLAR
|
| Temperature Grade |
|
COMMERCIAL
|
| Terminal Finish |
|
Matte Tin (Sn)
|
| Terminal Form |
|
GULL WING
|
| Terminal Pitch |
|
1.27 mm
|
| Terminal Position |
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
| Unity Gain BW-Nom |
|
1000
|
| Voltage Gain-Min |
|
15000
|
| Width |
|
3.9 mm
|
| Base Number Matches |
|
1
|
|
|
|
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