LM358N/NOPB vs LM158H feature comparison

LM358N/NOPB National Semiconductor Corporation

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LM158H Freescale Semiconductor

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Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP MOTOROLA SEMICONDUCTOR PRODUCTS
Part Package Code DIP
Package Description PLASTIC, DIP-8 , CAN8,.2
Pin Count 8
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.33.00.01
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Architecture VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB) 0.05 µA
Bias Current-Max (IIB) @25C 0.25 µA
Common-mode Reject Ratio-Min 65 dB
Common-mode Reject Ratio-Nom 85 dB
Frequency Compensation YES YES
Input Offset Voltage-Max 9000 µV 7000 µV
JESD-30 Code R-PDIP-T8 O-MBCY-W8
JESD-609 Code e3 e0
Length 9.817 mm
Low-Offset NO NO
Moisture Sensitivity Level 1
Neg Supply Voltage Limit-Max
Neg Supply Voltage-Nom (Vsup)
Number of Functions 2 2
Number of Terminals 8 8
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Package Body Material PLASTIC/EPOXY METAL
Package Code DIP
Package Equivalence Code DIP8,.3 CAN8,.2
Package Shape RECTANGULAR ROUND
Package Style IN-LINE CYLINDRICAL
Packing Method RAIL
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm
Slew Rate-Nom 0.1 V/us
Supply Current-Max 2 mA
Supply Voltage Limit-Max 32 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology BIPOLAR BIPOLAR
Temperature Grade COMMERCIAL MILITARY
Terminal Finish Matte Tin (Sn) Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE WIRE
Terminal Pitch 2.54 mm
Terminal Position DUAL BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
Unity Gain BW-Nom 1000
Voltage Gain-Min 25000
Width 7.62 mm
Base Number Matches 2 8
Power Supplies +-1.5/+-15/3/30 V

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