LM358N
vs
LM358N
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
SAMSUNG SEMICONDUCTOR INC
|
KEC CORP
|
| Part Package Code |
DIP
|
|
| Package Description |
DIP-8
|
|
| Pin Count |
8
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Samacsys Manufacturer |
SAMSUNG
|
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Architecture |
VOLTAGE-FEEDBACK
|
|
| Average Bias Current-Max (IIB) |
0.5 µA
|
|
| Bias Current-Max (IIB) @25C |
0.25 µA
|
|
| Common-mode Reject Ratio-Nom |
100 dB
|
|
| Frequency Compensation |
YES
|
|
| Input Offset Voltage-Max |
9000 µV
|
|
| JESD-30 Code |
R-PDIP-T8
|
|
| JESD-609 Code |
e0
|
|
| Length |
9.2 mm
|
|
| Low-Offset |
NO
|
|
| Neg Supply Voltage Limit-Max |
-18 V
|
|
| Number of Functions |
2
|
|
| Number of Terminals |
8
|
|
| Operating Temperature-Max |
70 °C
|
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
DIP
|
|
| Package Equivalence Code |
DIP8,.3
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
IN-LINE
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
4.55 mm
|
|
| Supply Current-Max |
2 mA
|
|
| Supply Voltage Limit-Max |
18 V
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
|
| Surface Mount |
NO
|
|
| Technology |
BIPOLAR
|
|
| Temperature Grade |
COMMERCIAL
|
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
THROUGH-HOLE
|
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
|
| Voltage Gain-Min |
15000
|
|
| Width |
7.62 mm
|
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare LM358N with alternatives
Compare LM358N with alternatives