LM358TP
vs
LM358TP/NOPB
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
NATIONAL SEMICONDUCTOR CORP
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
FBGA,
|
LEAD FREE, MICRO, BUMP, SMD-8
|
| Pin Count |
8
|
8
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Average Bias Current-Max (IIB) |
0.05 µA
|
0.05 µA
|
| Common-mode Reject Ratio-Min |
65 dB
|
|
| Common-mode Reject Ratio-Nom |
85 dB
|
85 dB
|
| Input Offset Voltage-Max |
9000 µV
|
9000 µV
|
| JESD-30 Code |
S-PBGA-B8
|
S-PBGA-B8
|
| JESD-609 Code |
e1
|
e1
|
| Length |
1.285 mm
|
1.285 mm
|
| Micropower |
NO
|
|
| Moisture Sensitivity Level |
1
|
1
|
| Neg Supply Voltage Limit-Max |
|
|
| Neg Supply Voltage-Nom (Vsup) |
|
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
FBGA
|
FBGA
|
| Package Equivalence Code |
BGA8,3X3,20
|
BGA8,3X3,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, FINE PITCH
|
GRID ARRAY, FINE PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Current-Max |
2 mA
|
2 mA
|
| Supply Voltage Limit-Max |
32 V
|
32 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN SILVER COPPER
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Unity Gain BW-Nom |
1000
|
1000
|
| Voltage Gain-Min |
15000
|
15000
|
| Width |
1.285 mm
|
1.285 mm
|
| Base Number Matches |
2
|
2
|
| Architecture |
|
VOLTAGE-FEEDBACK
|
| Bias Current-Max (IIB) @25C |
|
0.25 µA
|
| Frequency Compensation |
|
YES
|
| Low-Offset |
|
NO
|
| Packing Method |
|
TAPE AND REEL
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare LM358TP with alternatives
Compare LM358TP/NOPB with alternatives