LM3676SD-ADJ/NOPB
vs
LM3676SD-ADJ/NOPB
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
NATIONAL SEMICONDUCTOR CORP
|
| Part Package Code |
SOIC
|
|
| Package Description |
LEAD FREE, LLP-8
|
LEAD FREE, LLP-8
|
| Pin Count |
8
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| Analog IC - Other Type |
SWITCHING REGULATOR
|
SWITCHING REGULATOR
|
| Control Technique |
PULSE WIDTH MODULATION
|
PULSE WIDTH MODULATION
|
| Input Voltage-Max |
5.5 V
|
5.5 V
|
| Input Voltage-Min |
2.9 V
|
2.9 V
|
| Input Voltage-Nom |
3.6 V
|
3.6 V
|
| JESD-30 Code |
S-XDSO-N8
|
R-XDSO-N8
|
| JESD-609 Code |
e3
|
e3
|
| Length |
3 mm
|
3 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-30 °C
|
-30 °C
|
| Output Current-Max |
1.2 A
|
1.2 A
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
HVSON
|
HVSON
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Seated Height-Max |
0.8 mm
|
0.8 mm
|
| Surface Mount |
YES
|
YES
|
| Switcher Configuration |
BUCK
|
BUCK
|
| Switching Frequency-Max |
2600 kHz
|
2600 kHz
|
| Temperature Grade |
OTHER
|
OTHER
|
| Terminal Finish |
TIN
|
Matte Tin (Sn)
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
| Width |
3 mm
|
3 mm
|
| Base Number Matches |
1
|
1
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.39.00.01
|
| Control Mode |
|
VOLTAGE-MODE
|
| Package Equivalence Code |
|
SOLCC8,.11,20
|
| Qualification Status |
|
Not Qualified
|
|
|
|