LM385M3-2.5/NOPB
vs
SPX385M1-2.5
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
SIPEX CORP
|
| Package Description |
SOT-23, 3 PIN
|
SOT-89, 3 PIN
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Analog IC - Other Type |
TWO TERMINAL VOLTAGE REFERENCE
|
TWO TERMINAL VOLTAGE REFERENCE
|
| JESD-30 Code |
R-PDSO-G3
|
R-PSSO-F3
|
| JESD-609 Code |
e3
|
e0
|
| Length |
2.92 mm
|
4.5 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Outputs |
1
|
1
|
| Number of Terminals |
3
|
3
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Output Voltage-Max |
2.575 V
|
2.55 V
|
| Output Voltage-Min |
2.425 V
|
2.45 V
|
| Output Voltage-Nom |
2.5 V
|
2.5 V
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
SOF
|
| Package Equivalence Code |
TO-236
|
TO-243
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
240
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.12 mm
|
1.6 mm
|
| Supply Current-Max (Isup) |
20 mA
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Temp Coef of Voltage-Max |
150 ppm/°C
|
100 ppm/°C
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
Matte Tin (Sn)
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
FLAT
|
| Terminal Pitch |
0.953 mm
|
1.5 mm
|
| Terminal Position |
DUAL
|
SINGLE
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Trim/Adjustable Output |
NO
|
YES
|
| Voltage Tolerance-Max |
1.52%
|
2%
|
| Width |
1.4 mm
|
2.5 mm
|
| Base Number Matches |
3
|
2
|
|
|
|
Compare LM385M3-2.5/NOPB with alternatives