LM3900N vs LM3900DR2 feature comparison

LM3900N National Semiconductor Corporation

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LM3900DR2 onsemi

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP ON SEMICONDUCTOR
Part Package Code DIP SOIC
Package Description PLASTIC, DIP-14 SOP,
Pin Count 14 14
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.33.00.01 8542.33.00.01
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Architecture VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB) 0.2 µA 0.2 µA
Frequency Compensation YES
JESD-30 Code R-PDIP-T14 R-PDSO-G14
JESD-609 Code e0 e0
Length 19.18 mm 8.65 mm
Low-Offset NO
Number of Functions 4 4
Number of Terminals 14 14
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 1.75 mm
Supply Current-Max 10 mA
Supply Voltage-Nom (Vsup) 15 V 15 V
Surface Mount NO YES
Technology BIPOLAR BIPOLAR
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Unity Gain BW-Nom 2500 4000
Width 7.62 mm 3.9 mm
Base Number Matches 8 3
Slew Rate-Nom 0.5 V/us
Supply Voltage Limit-Max 32 V

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