LM4040DEM3-2.0
vs
LM4040DYM3-2.5
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
PLASTIC, TO-236AB, SOT-23, 3 PIN
|
LEAD FREE, SOT-23, 3 PIN
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog IC - Other Type |
TWO TERMINAL VOLTAGE REFERENCE
|
TWO TERMINAL VOLTAGE REFERENCE
|
| JESD-30 Code |
R-PDSO-G3
|
R-PDSO-G3
|
| JESD-609 Code |
e0
|
e4
|
| Length |
2.92 mm
|
2.86 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Outputs |
1
|
1
|
| Number of Terminals |
3
|
3
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Voltage-Max |
2.098 V
|
2.549 V
|
| Output Voltage-Min |
1.998 V
|
2.451 V
|
| Output Voltage-Nom |
2.048 V
|
2.5 V
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
TSSOP
|
| Package Equivalence Code |
TO-236
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.12 mm
|
1.15 mm
|
| Surface Mount |
YES
|
YES
|
| Technology |
BIPOLAR
|
|
| Temp Coef of Voltage-Max |
150 ppm/°C
|
150 ppm/°C
|
| Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.95 mm
|
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Trim/Adjustable Output |
NO
|
NO
|
| Voltage Tolerance-Max |
1%
|
|
| Width |
1.3 mm
|
1.295 mm
|
| Base Number Matches |
2
|
2
|
|
|
|
Compare LM4040DEM3-2.0 with alternatives
Compare LM4040DYM3-2.5 with alternatives