LM4040DEM3-2.5+
vs
LM4040DIM3X-2.5
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
NATIONAL SEMICONDUCTOR CORP
|
| Package Description |
,
|
PLASTIC, TO-236AB, SOT-23, 3 PIN
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Analog IC - Other Type |
TWO TERMINAL VOLTAGE REFERENCE
|
TWO TERMINAL VOLTAGE REFERENCE
|
| JESD-609 Code |
e3
|
e0
|
| Moisture Sensitivity Level |
1
|
1
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Terminal Finish |
MATTE TIN
|
Tin/Lead (Sn/Pb)
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
40
|
| Base Number Matches |
2
|
3
|
| JESD-30 Code |
|
R-PDSO-G3
|
| Length |
|
2.92 mm
|
| Number of Functions |
|
1
|
| Number of Outputs |
|
1
|
| Number of Terminals |
|
3
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Output Voltage-Max |
|
2.549 V
|
| Output Voltage-Min |
|
2.451 V
|
| Output Voltage-Nom |
|
2.5 V
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
TSSOP
|
| Package Equivalence Code |
|
TO-236
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
1.12 mm
|
| Supply Current-Max (Isup) |
|
0.065 mA
|
| Surface Mount |
|
YES
|
| Technology |
|
BIPOLAR
|
| Temp Coef of Voltage-Max |
|
150 ppm/°C
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Form |
|
GULL WING
|
| Terminal Pitch |
|
0.95 mm
|
| Terminal Position |
|
DUAL
|
| Trim/Adjustable Output |
|
NO
|
| Voltage Tolerance-Max |
|
1%
|
| Width |
|
1.3 mm
|
|
|
|
Compare LM4040DEM3-2.5+ with alternatives