LM4872IBP/NOPB
vs
MAX9789AETJ+
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
MAXIM INTEGRATED PRODUCTS INC
|
| Package Description |
FBGA,
|
5 X 5 MM, 0.80 MM HEIGHT, ROHS COMPLIANT, MO-220WHHD-2,TQFN-32
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Bandwidth-Nom |
20 kHz
|
20 kHz
|
| Consumer IC Type |
AUDIO AMPLIFIER
|
CLASS AB AUDIO AMPLIFIER
|
| Harmonic Distortion |
0.2%
|
|
| JESD-30 Code |
R-PBGA-B8
|
S-XQCC-N32
|
| Length |
1.97 mm
|
5 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Channels |
1
|
2
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
32
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Power-Nom |
1 W
|
2 W
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
FBGA
|
HVQCCN
|
| Package Equivalence Code |
BGA8,3X3,20
|
LCC32,.2SQ,20
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
GRID ARRAY, FINE PITCH
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Current-Max |
7 mA
|
40 mA
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
4.5 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
BALL
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
QUAD
|
| Width |
1.31 mm
|
5 mm
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Part Package Code |
|
QFN
|
| Pin Count |
|
32
|
| Factory Lead Time |
|
4 Weeks
|
| Gain |
|
21.6 dB
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Seated Height-Max |
|
0.8 mm
|
| Technology |
|
BICMOS
|
| Terminal Finish |
|
NICKEL GOLD PALLADIUM
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare LM4872IBP/NOPB with alternatives
Compare MAX9789AETJ+ with alternatives