LM4894LDX/NOPB
vs
MAX9654AUB+
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Not Recommended
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
|
| Part Package Code |
SON
|
10-MINI_SO-N/A
|
| Package Description |
HVSON, SOLCC10,.16,20
|
|
| Pin Count |
10
|
10
|
| Reach Compliance Code |
compliant
|
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.33.00.01
|
|
| Bandwidth-Nom |
20 kHz
|
30000 kHz
|
| Consumer IC Type |
AUDIO AMPLIFIER
|
VIDEO AMPLIFIER
|
| Harmonic Distortion |
1%
|
|
| JESD-30 Code |
R-XDSO-N10
|
S-PDSO-G10
|
| JESD-609 Code |
e3
|
e3
|
| Length |
4 mm
|
3 mm
|
| Moisture Sensitivity Level |
3
|
1
|
| Number of Channels |
1
|
3
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
10
|
10
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Power-Nom |
1.4 W
|
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
HVSON
|
TSSOP
|
| Package Equivalence Code |
SOLCC10,.16,20
|
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
0.8 mm
|
1.1 mm
|
| Supply Current-Max |
8 mA
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
3.465 V
|
| Supply Voltage-Min (Vsup) |
2.2 V
|
3.135 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
| Terminal Finish |
Matte Tin (Sn)
|
Matte Tin (Sn)
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
30
|
| Width |
3 mm
|
3 mm
|
| Base Number Matches |
1
|
2
|
| Manufacturer Package Code |
|
10-MINI_SO-N/A
|
| Date Of Intro |
|
2008-08-07
|
| Samacsys Manufacturer |
|
Analog Devices
|
| Technology |
|
BICMOS
|
|
|
|
Compare LM4894LDX/NOPB with alternatives
Compare MAX9654AUB+ with alternatives