LM4995SD
vs
MAX9711ETC+
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
MAXIM INTEGRATED PRODUCTS INC
|
| Package Description |
3 X 3 MM, 0.5 PICTH, LLP-8
|
4 X 4 MM, 0.80 MM HEIGHT, EXPOSED PAD, QFN-12
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Bandwidth-Nom |
20 kHz
|
22 kHz
|
| Consumer IC Type |
AUDIO AMPLIFIER
|
CLASS AB AUDIO AMPLIFIER
|
| JESD-30 Code |
S-XDSO-N8
|
S-XQCC-N12
|
| JESD-609 Code |
e3
|
e3
|
| Length |
3 mm
|
4 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Channels |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
12
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Power-Nom |
1.25 W
|
3 W
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
HVSON
|
HVQCCN
|
| Package Equivalence Code |
SOLCC8,.11,20
|
LCC12,.16SQ,32
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
0.8 mm
|
0.8 mm
|
| Supply Current-Max |
2.5 mA
|
17 mA
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2.4 V
|
4.5 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
MATTE TIN
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.8 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
30
|
| Width |
3 mm
|
4 mm
|
| Base Number Matches |
3
|
4
|
| Pbfree Code |
|
Yes
|
| Part Package Code |
|
QFN
|
| Pin Count |
|
12
|
| Technology |
|
BICMOS
|
|
|
|
Compare LM4995SD with alternatives
Compare MAX9711ETC+ with alternatives