LM5001SDX/NOPB
vs
LM5001SD
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
NATIONAL SEMICONDUCTOR CORP
|
Package Description |
4 X 4 MM, GREEN, LLP-8
|
4 X 4 MM, LLP-8
|
Reach Compliance Code |
unknown
|
not_compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Analog IC - Other Type |
SWITCHING REGULATOR
|
SWITCHING REGULATOR
|
Control Mode |
CURRENT-MODE
|
CURRENT-MODE
|
Control Technique |
PULSE WIDTH MODULATION
|
PULSE WIDTH MODULATION
|
Input Voltage-Max |
75 V
|
75 V
|
Input Voltage-Min |
3.1 V
|
3.1 V
|
Input Voltage-Nom |
10 V
|
10 V
|
JESD-30 Code |
S-XDSO-N8
|
S-XDSO-N8
|
JESD-609 Code |
e3
|
e0
|
Length |
4 mm
|
4 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
8
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Current-Max |
1.2 A
|
1.2 A
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Code |
HVSON
|
HVSON
|
Package Equivalence Code |
SOLCC8,.15,32
|
SOLCC8,.15,32
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
0.8 mm
|
0.8 mm
|
Surface Mount |
YES
|
YES
|
Switcher Configuration |
BOOST
|
BOOST
|
Switching Frequency-Max |
900 kHz
|
900 kHz
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Finish |
Matte Tin (Sn)
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
Width |
4 mm
|
4 mm
|
Base Number Matches |
2
|
2
|
|
|
|
Compare LM5001SDX/NOPB with alternatives
Compare LM5001SD with alternatives