LM741CN vs LM741CN/NOPB feature comparison

LM741CN Samsung Semiconductor

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LM741CN/NOPB National Semiconductor Corporation

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Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC NATIONAL SEMICONDUCTOR CORP
Part Package Code DIP DIP
Package Description DIP-8 DIP-8
Pin Count 8 8
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.33.00.01 8542.33.00.01
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Architecture VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB) 0.8 µA 0.8 µA
Bias Current-Max (IIB) @25C 0.5 µA 0.5 µA
Common-mode Reject Ratio-Nom 90 dB 90 dB
Frequency Compensation YES YES
Input Offset Voltage-Max 7500 µV 7500 µV
JESD-30 Code R-PDIP-T8 R-PDIP-T8
JESD-609 Code e0 e3
Length 9.2 mm 9.8171 mm
Low-Offset NO NO
Neg Supply Voltage Limit-Max -18 V -18 V
Neg Supply Voltage-Nom (Vsup) -15 V -15 V
Number of Functions 1 1
Number of Terminals 8 8
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP8,.3 DIP8,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.55 mm 5.08 mm
Slew Rate-Nom 0.5 V/us 0.5 V/us
Supply Current-Max 5.6 mA 2.8 mA
Supply Voltage Limit-Max 18 V 18 V
Supply Voltage-Nom (Vsup) 15 V 15 V
Surface Mount NO NO
Technology BIPOLAR BIPOLAR
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD Matte Tin (Sn)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Voltage Gain-Min 15000 15000
Width 7.62 mm 7.62 mm
Base Number Matches 12 2
Common-mode Reject Ratio-Min 70 dB
Moisture Sensitivity Level 1
Packing Method RAIL
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 40
Unity Gain BW-Nom 1500

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