LM75BD vs TCN75-3.3MOA713G feature comparison

LM75BD NXP Semiconductors

Buy Now Datasheet

TCN75-3.3MOA713G Microchip Technology Inc

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer NXP SEMICONDUCTORS MICROCHIP TECHNOLOGY INC
Package Description 3.9MM, PLASTIC, SOP -8 SOP8,.25
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01
Samacsys Manufacturer NXP
Accuracy-Max (Cel) 3 Cel 3 Cel
Body Breadth 3.9 mm 3.9 mm
Body Height 1.75 mm 1.72 mm
Body Length or Diameter 4.9 mm 4.89 mm
Housing PLASTIC PLASTIC
JESD-609 Code e4 e3
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Number of Bits 11 9
Number of Terminals 8 8
Operating Current-Max 5 mA 0.25 mA
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Output Interface Type 2-WIRE INTERFACE 2-WIRE INTERFACE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Equivalence Code SOP8,.25 SOP8,.25
Package Shape/Style RECTANGULAR RECTANGULAR
Sensors/Transducers Type TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 2.8 V 2.7 V
Surface Mount YES YES
Terminal Finish Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) Matte Tin (Sn)
Termination Type SOLDER SOLDER
Base Number Matches 6 1
Pbfree Code Yes
Temperature Coefficient POSITIVE ppm/°C

Compare LM75BD with alternatives

Compare TCN75-3.3MOA713G with alternatives