LMC6032MWA
vs
LMC6442IN/NOPB
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
NATIONAL SEMICONDUCTOR CORP
|
| Part Package Code |
WAFER
|
DIP
|
| Package Description |
DIE, WAFER
|
0.300 INCH, PLASTIC, DIP-8
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Architecture |
VOLTAGE-FEEDBACK
|
VOLTAGE-FEEDBACK
|
| Common-mode Reject Ratio-Nom |
83 dB
|
92 dB
|
| Frequency Compensation |
YES
|
YES
|
| Input Offset Voltage-Max |
9000 µV
|
8000 µV
|
| JESD-30 Code |
X-XUUC-N
|
R-PDIP-T8
|
| Low-Bias |
YES
|
YES
|
| Low-Offset |
NO
|
NO
|
| Micropower |
YES
|
YES
|
| Neg Supply Voltage Limit-Max |
|
|
| Neg Supply Voltage-Nom (Vsup) |
|
|
| Number of Functions |
2
|
2
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
DIE
|
DIP
|
| Package Equivalence Code |
WAFER
|
DIP8,.3
|
| Package Shape |
UNSPECIFIED
|
RECTANGULAR
|
| Package Style |
UNCASED CHIP
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Slew Rate-Min |
0.4 V/us
|
0.0022 V/us
|
| Slew Rate-Nom |
1.1 V/us
|
0.0022 V/us
|
| Supply Current-Max |
1.9 mA
|
0.0032 mA
|
| Supply Voltage Limit-Max |
16 V
|
16 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
2.2 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
NO LEAD
|
THROUGH-HOLE
|
| Terminal Position |
UPPER
|
DUAL
|
| Unity Gain BW-Nom |
1400
|
9.5
|
| Voltage Gain-Min |
20000
|
10000
|
| Base Number Matches |
2
|
3
|
| Rohs Code |
|
Yes
|
| Pin Count |
|
8
|
| Average Bias Current-Max (IIB) |
|
0.000004 µA
|
| JESD-609 Code |
|
e3
|
| Length |
|
9.817 mm
|
| Moisture Sensitivity Level |
|
1
|
| Number of Terminals |
|
8
|
| Packing Method |
|
RAIL
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Seated Height-Max |
|
5.08 mm
|
| Terminal Finish |
|
Matte Tin (Sn)
|
| Terminal Pitch |
|
2.54 mm
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
| Width |
|
7.62 mm
|
|
|
|
Compare LMC6032MWA with alternatives
Compare LMC6442IN/NOPB with alternatives