LMC6032MWA
vs
LMV824MTC
feature comparison
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
WAFER
|
TSSOP
|
| Package Description |
DIE, WAFER
|
TSSOP, TSSOP14,.25
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Architecture |
VOLTAGE-FEEDBACK
|
|
| Common-mode Reject Ratio-Nom |
83 dB
|
85 dB
|
| Frequency Compensation |
YES
|
|
| Input Offset Voltage-Max |
9000 µV
|
4000 µV
|
| JESD-30 Code |
X-XUUC-N
|
R-PDSO-G14
|
| Low-Bias |
YES
|
|
| Low-Offset |
NO
|
|
| Micropower |
YES
|
|
| Neg Supply Voltage Limit-Max |
|
-2.75 V
|
| Neg Supply Voltage-Nom (Vsup) |
|
|
| Number of Functions |
2
|
4
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
DIE
|
TSSOP
|
| Package Equivalence Code |
WAFER
|
TSSOP14,.25
|
| Package Shape |
UNSPECIFIED
|
RECTANGULAR
|
| Package Style |
UNCASED CHIP
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Slew Rate-Min |
0.4 V/us
|
|
| Slew Rate-Nom |
1.1 V/us
|
1.5 V/us
|
| Supply Current-Max |
1.9 mA
|
|
| Supply Voltage Limit-Max |
16 V
|
2.75 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
2.7 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Position |
UPPER
|
DUAL
|
| Unity Gain BW-Nom |
1400
|
5000
|
| Voltage Gain-Min |
20000
|
|
| Base Number Matches |
2
|
2
|
| Pin Count |
|
14
|
| Average Bias Current-Max (IIB) |
|
0.14 µA
|
| Length |
|
5 mm
|
| Number of Terminals |
|
14
|
| Seated Height-Max |
|
1.2 mm
|
| Terminal Pitch |
|
0.65 mm
|
| Width |
|
4.4 mm
|
|
|
|
Compare LMC6032MWA with alternatives