LMC6442AIMM
vs
LMC6482AIM
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
NATIONAL SEMICONDUCTOR CORP
|
| Package Description |
TSSOP, TSSOP8,.19
|
SO-8
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Architecture |
VOLTAGE-FEEDBACK
|
VOLTAGE-FEEDBACK
|
| Average Bias Current-Max (IIB) |
0.000004 µA
|
0.000004 µA
|
| Common-mode Reject Ratio-Nom |
92 dB
|
82 dB
|
| Frequency Compensation |
YES
|
YES
|
| Input Offset Voltage-Max |
4000 µV
|
750 µV
|
| JESD-30 Code |
S-PDSO-G8
|
R-PDSO-G8
|
| JESD-609 Code |
e0
|
e0
|
| Length |
3 mm
|
4.9 mm
|
| Low-Bias |
YES
|
YES
|
| Low-Offset |
NO
|
NO
|
| Micropower |
YES
|
YES
|
| Neg Supply Voltage Limit-Max |
|
|
| Neg Supply Voltage-Nom (Vsup) |
|
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
SOP
|
| Package Equivalence Code |
TSSOP8,.19
|
SOP8,.25
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.1 mm
|
1.75 mm
|
| Slew Rate-Min |
0.0022 V/us
|
0.7 V/us
|
| Slew Rate-Nom |
0.0022 V/us
|
1.3 V/us
|
| Supply Current-Max |
3.2 mA
|
1.9 mA
|
| Supply Voltage Limit-Max |
16 V
|
16 V
|
| Supply Voltage-Nom (Vsup) |
2.2 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Unity Gain BW-Nom |
9.5
|
1500
|
| Voltage Gain-Min |
4000
|
13000
|
| Width |
3 mm
|
3.9 mm
|
| Base Number Matches |
2
|
2
|
| Part Package Code |
|
SOIC
|
| Pin Count |
|
8
|
| Common-mode Reject Ratio-Min |
|
67 dB
|
| Moisture Sensitivity Level |
|
1
|
| Packing Method |
|
RAIL
|
| Peak Reflow Temperature (Cel) |
|
235
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare LMC6442AIMM with alternatives
Compare LMC6482AIM with alternatives