LMC6462AIN/NOPB vs LMC6462AIM feature comparison

LMC6462AIN/NOPB Rochester Electronics LLC

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LMC6462AIM National Semiconductor Corporation

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Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Active Transferred
Ihs Manufacturer ROCHESTER ELECTRONICS INC NATIONAL SEMICONDUCTOR CORP
Part Package Code DIP SOIC
Package Description DIP, SOIC-8
Pin Count 8 8
Reach Compliance Code unknown not_compliant
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Average Bias Current-Max (IIB) 0.00001 µA 0.00001 µA
Common-mode Reject Ratio-Nom 74 dB 74 dB
Input Offset Voltage-Max 2000 µV 2000 µV
JESD-30 Code R-PDIP-T8 R-PDSO-G8
JESD-609 Code e3 e0
Length 9.817 mm 4.9 mm
Moisture Sensitivity Level 1 1
Neg Supply Voltage Limit-Max
Neg Supply Voltage-Nom (Vsup)
Number of Functions 2 2
Number of Terminals 8 8
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 260 235
Seated Height-Max 5.08 mm 1.75 mm
Slew Rate-Nom 0.023 V/us 0.023 V/us
Supply Voltage Limit-Max 16 V 16 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 40 30
Unity Gain BW-Nom 50 50
Width 7.62 mm 3.9 mm
Base Number Matches 3 3
ECCN Code EAR99
HTS Code 8542.33.00.01
Architecture VOLTAGE-FEEDBACK
Common-mode Reject Ratio-Min 67 dB
Frequency Compensation YES
Low-Bias YES
Low-Offset NO
Micropower YES
Package Equivalence Code SOP8,.25
Packing Method RAIL
Qualification Status Not Qualified
Slew Rate-Min 0.008 V/us
Supply Current-Max 0.07 mA

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