LMC6462AIN/NOPB vs LMC6462AIMDC feature comparison

LMC6462AIN/NOPB Rochester Electronics LLC

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LMC6462AIMDC Texas Instruments

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS INC NATIONAL SEMICONDUCTOR CORP
Part Package Code DIP DIE
Package Description DIP, DIE, DIE OR CHIP
Pin Count 8
Reach Compliance Code unknown compliant
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Average Bias Current-Max (IIB) 0.00001 µA
Common-mode Reject Ratio-Nom 74 dB 74 dB
Input Offset Voltage-Max 2000 µV 2000 µV
JESD-30 Code R-PDIP-T8 X-XUUC-N
JESD-609 Code e3
Length 9.817 mm
Moisture Sensitivity Level 1 1
Neg Supply Voltage Limit-Max
Neg Supply Voltage-Nom (Vsup)
Number of Functions 2 2
Number of Terminals 8
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code DIP DIE
Package Shape RECTANGULAR UNSPECIFIED
Package Style IN-LINE UNCASED CHIP
Peak Reflow Temperature (Cel) 260 260
Seated Height-Max 5.08 mm
Slew Rate-Nom 0.023 V/us 0.023 V/us
Supply Voltage Limit-Max 16 V 16 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN
Terminal Form THROUGH-HOLE NO LEAD
Terminal Pitch 2.54 mm
Terminal Position DUAL UPPER
Time@Peak Reflow Temperature-Max (s) 40 40
Unity Gain BW-Nom 50 50
Width 7.62 mm
Base Number Matches 3 2
ECCN Code EAR99
HTS Code 8542.33.00.01
Architecture VOLTAGE-FEEDBACK
Frequency Compensation YES
Low-Bias YES
Low-Offset NO
Micropower YES
Package Equivalence Code DIE OR CHIP
Qualification Status Not Qualified
Slew Rate-Min 8 V/us
Supply Current-Max 0.07 mA

Compare LMC6462AIN/NOPB with alternatives

Compare LMC6462AIMDC with alternatives