LMC6462AIN/NOPB vs LMC6462AIMWC feature comparison

LMC6462AIN/NOPB National Semiconductor Corporation

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LMC6462AIMWC Texas Instruments

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Rohs Code Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP NATIONAL SEMICONDUCTOR CORP
Part Package Code DIP WAFER
Package Description DIP, DIP8,.3 DIE, WAFER
Pin Count 8
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.33.00.01 8542.33.00.01
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Architecture VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB) 0.00001 µA
Common-mode Reject Ratio-Min 67 dB
Common-mode Reject Ratio-Nom 74 dB 74 dB
Frequency Compensation YES YES
Input Offset Voltage-Max 2000 µV 2000 µV
JESD-30 Code R-PDIP-T8 X-XUUC-N
JESD-609 Code e3
Length 9.817 mm
Low-Bias YES YES
Low-Offset NO NO
Micropower YES YES
Moisture Sensitivity Level 1
Neg Supply Voltage Limit-Max
Neg Supply Voltage-Nom (Vsup)
Number of Functions 2 2
Number of Terminals 8
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code DIP DIE
Package Equivalence Code DIP8,.3 WAFER
Package Shape RECTANGULAR UNSPECIFIED
Package Style IN-LINE UNCASED CHIP
Packing Method RAIL
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm
Slew Rate-Min 0.008 V/us 8 V/us
Slew Rate-Nom 0.023 V/us 0.023 V/us
Supply Current-Max 0.07 mA 0.07 mA
Supply Voltage Limit-Max 16 V 16 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Matte Tin (Sn)
Terminal Form THROUGH-HOLE NO LEAD
Terminal Pitch 2.54 mm
Terminal Position DUAL UPPER
Time@Peak Reflow Temperature-Max (s) 40
Unity Gain BW-Nom 50 50
Width 7.62 mm
Base Number Matches 3 2

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