LMC6482AIMX
vs
LMC6082IM
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Transferred
|
Not Recommended
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
ROCHESTER ELECTRONICS LLC
|
| Part Package Code |
SOIC
|
|
| Package Description |
SOIC-8
|
|
| Pin Count |
8
|
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Architecture |
VOLTAGE-FEEDBACK
|
|
| Average Bias Current-Max (IIB) |
0.000004 µA
|
|
| Common-mode Reject Ratio-Min |
67 dB
|
|
| Common-mode Reject Ratio-Nom |
82 dB
|
|
| Frequency Compensation |
YES
|
|
| Input Offset Voltage-Max |
750 µV
|
|
| JESD-30 Code |
R-PDSO-G8
|
|
| JESD-609 Code |
e0
|
|
| Length |
4.9 mm
|
|
| Low-Bias |
YES
|
|
| Low-Offset |
NO
|
|
| Micropower |
YES
|
|
| Moisture Sensitivity Level |
1
|
|
| Neg Supply Voltage Limit-Max |
|
|
| Neg Supply Voltage-Nom (Vsup) |
|
|
| Number of Functions |
2
|
|
| Number of Terminals |
8
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
SOP
|
|
| Package Equivalence Code |
SOP8,.25
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
SMALL OUTLINE
|
|
| Packing Method |
TAPE AND REEL
|
|
| Peak Reflow Temperature (Cel) |
235
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.75 mm
|
|
| Slew Rate-Min |
0.7 V/us
|
|
| Slew Rate-Nom |
1.3 V/us
|
|
| Supply Current-Max |
1.9 mA
|
|
| Supply Voltage Limit-Max |
16 V
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Terminal Form |
GULL WING
|
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
DUAL
|
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Unity Gain BW-Nom |
1500
|
|
| Voltage Gain-Min |
13000
|
|
| Width |
3.9 mm
|
|
| Base Number Matches |
2
|
3
|
|
|
|
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