LMC6762BIN
vs
LM219D
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
NXP SEMICONDUCTORS
|
| Part Package Code |
DIP
|
SOIC
|
| Package Description |
DIP, DIP8,.3
|
3.90 MM, PLASTIC, MS-012, SOT-108-1, SO-14
|
| Pin Count |
8
|
14
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Amplifier Type |
COMPARATOR
|
COMPARATOR
|
| Average Bias Current-Max (IIB) |
0.000001 µA
|
1 µA
|
| Input Offset Voltage-Max |
15000 µV
|
7000 µV
|
| JESD-30 Code |
R-PDIP-T8
|
R-PDSO-G14
|
| JESD-609 Code |
e0
|
|
| Length |
9.817 mm
|
8.65 mm
|
| Neg Supply Voltage Limit-Max |
|
-18 V
|
| Neg Supply Voltage-Nom (Vsup) |
|
-15 V
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
8
|
14
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-25 °C
|
| Output Type |
PUSH-PULL
|
OPEN-COLLECTOR
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
SOP
|
| Package Equivalence Code |
DIP8,.3
|
SOP14,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Response Time-Nom |
4000 ns
|
80 ns
|
| Seated Height-Max |
5.08 mm
|
1.75 mm
|
| Supply Current-Max |
0.025 mA
|
12.5 mA
|
| Supply Voltage Limit-Max |
16 V
|
18 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
15 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
BIPOLAR
|
| Temperature Grade |
INDUSTRIAL
|
OTHER
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
3.9 mm
|
| Base Number Matches |
1
|
2
|
| Bias Current-Max (IIB) @25C |
|
0.5 µA
|
|
|
|
Compare LMC6762BIN with alternatives
Compare LM219D with alternatives