LMC6762BIN vs LMC6772QMMX feature comparison

LMC6762BIN National Semiconductor Corporation

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LMC6772QMMX Texas Instruments

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP TEXAS INSTRUMENTS INC
Part Package Code DIP MSOP
Package Description DIP, DIP8,.3 TSSOP,
Pin Count 8 8
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Amplifier Type COMPARATOR COMPARATOR
Average Bias Current-Max (IIB) 0.000001 µA
Input Offset Voltage-Max 15000 µV 13000 µV
JESD-30 Code R-PDIP-T8 S-PDSO-G8
JESD-609 Code e0 e0
Length 9.817 mm 3 mm
Neg Supply Voltage Limit-Max
Neg Supply Voltage-Nom (Vsup)
Number of Functions 2 2
Number of Terminals 8 8
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Type PUSH-PULL OPEN-DRAIN
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP TSSOP
Package Equivalence Code DIP8,.3
Package Shape RECTANGULAR SQUARE
Package Style IN-LINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Qualification Status Not Qualified Not Qualified
Response Time-Nom 4000 ns 4000 ns
Seated Height-Max 5.08 mm 1.09 mm
Supply Current-Max 0.025 mA
Supply Voltage Limit-Max 16 V 16 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 0.65 mm
Terminal Position DUAL DUAL
Width 7.62 mm 3 mm
Base Number Matches 1 2
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 40

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Compare LMC6772QMMX with alternatives